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AIC1117A 1a low dropout positive regulator analog integrations corporation si-soft research center ds-1117ag-02 20131018 3a1, 1 li-hsin 1 st rd., science park , hsinchu 300, taiwan , r.o.c. tel: 886-3-5772500 fax: 886-3-5772510 www.analog.com.tw 1 ? features ? dropout voltage 1.3v at 1a output current. ? fast transient response. ? line regulation, typical at 0.015%. ? load regulation, typical at 0.1% ? current limiting and thermal protection. ? adjustable output voltage or fixed at 1.8v, 2.5v and 3.3v. ? standard 3-pin power packages. ? applications ? active scsi terminators. ? post regulators for switching supplies. ? battery chargers. ? pc add-on card. ? description the AIC1117A is a low dropout, three terminals regulator designed to provide output current up to 1a. the device is available in an adjustable version and fixed output voltage of 1.8v, 2.5v and 3.3v. dropout voltage of maximum of 1.5v is guaranteed at 1a output current. the quality of low dropout voltage and fast transient response make this device ideal for low voltage microprocessor applications. the AIC1117A requires output capacitance of a minimum of 10 f for stability. built-in output current limiting and thermal limiting provide maximal protection to the AIC1117A against fault conditions. ? typical application circuit c2 10 ? f (note1) v out 3.3v v in 5v + + v ref rf2 205 ? 1% a dj AIC1117A c1 10 ? f 2 3 1 rf1 125 ? 1% v ref =v out - v adj =1.25v (typ.) v out =v ref x (1+rf2/rf1)+ i adj x rf2 i adj =55 ? a (typ.) (1) c1 needed if device is far away from filter capacitors. (2) c2 required for stability. adjustable voltage regulator c2 10 ? f (note1) v out 3.3v v in 5v + + gnd c1 10 ? f AIC1117A-33 1 2 3 fixed voltage regulator
AIC1117A 2 ? ordering information pin configuration to-252 top view 1: adj (gnd) 2: vout (tab) 3: vin 2 3 1 1 2 3 to-220 front view 1: adj (gnd) 2: vout (tab) 3: vin sot-223 top view 1: adj (gnd) 2: vout (tab) 3: vin 2 3 1 2 3 1 to-263 top view 1: adj (gnd) 2: vout (tab) 3: vin packing type tr: tape & reel tb: tube bg: bag (for sot-223) packaging type e: to-252 m: to-263 t: to-220 y: sot-223 p: lead free commercial g: green package output voltage default:adjustable 18: 1.8v 25: 2.5v 33: 3.3v AIC1117A-xx xxxx example: AIC1117A-25getr ? 2.5v version in to-252 green package & taping & reel packing type AIC1117A-25pytr ? 2.5v version in sot-223 lead free package & taping & reel packing type ? sot-223 marking part no. py gy AIC1117A bs17p bs17g AIC1117A-18 bs18p bs18g AIC1117A-25 bs25p bs25g AIC1117A-33 bs33p bs33g
AIC1117A 3 ? absolute maximum ratings vin pin to adj/gnd pin 7v operating temperature range ?40 ? c to 85 ? c storage temperature range ?65 ? c to 150 ? c maximum junction temperature 125 ? c lead temperature (soldering, 10 sec) 260 ? c thermal resistance (junction to case) to-220 3 ? c /w to-263 3 ? c /w sot-223 15? c /w to-252 12.5 ? c /w thermal resistance (junction to ambient) to-220 50? c/w (assume no ambient airflow, no heatsink) to-263 60? c/w sot-223 155 ? c/w to-252 100 ? c/w absolute maximum ratings are those values beyond which the life of a device may be impaired. ? test circuit refer to typical application circuit. ? electrical characteristics (v in =5v, t a =25 ? c, i o =10ma, unless otherwise specified) (note2) parameter test conditions min. typ. max. unit t j =25 ? c 1.238 1.25 1.262 reference voltage 0 ? c ? t j ? 125 ? c 2.65v ? v in ? 7v 10ma ? i o ? 1a 1.225 1.25 1.275 v AIC1117A-18, v in =3.3v 1.78 1.80 1.82 AIC1117A-25, v in =5v 2.47 2.50 2.53 AIC1117A-33, v in =5v 3.26 3.30 3.33 output voltage AIC1117A 0 ? c ? t j ? 125 ? c 2.65v ? v in ? 7v 10ma ? i o ? 1a 0.98v out v out 1.02v out v
AIC1117A 4 ? electrical characteristics (continued) parameter test conditions min. typ. max. unit 2.65? v in ? 7v, t j =25 ? c 0.015 0.2 line regulation 0 ? c ? t j ? 125 ? c 0.035 0.2 %v out t j =25 ? c, i o =10ma ~1a 0.1 0.3 load regulation 0 ? c ? t j ? 125 ? c 0.2 0.4 %v out dropout voltage ? v out , ? v ref =1%, i o =1a 1.3 1.5 v current limit 1 a adjusted pin current (i adj ) 2.65? v in ? 7v 10ma ? i o ? 1a 55 120 ? a adjusted pin current change ( ? i adj ) 2.65? v in ? 7v 10ma ? i o ? 1a 0.2 5 ? a temperature stability i o =0.5a 0 ? c ? t j ? 125 ? c 0.5 % v out minimum load current ( adj. ) 5 10 ma quiescent current ( fixed version) 10 14 ma rms output noise (% of v out ) 10hz ? f ? 10khz 0.003 %v out ripple rejection ratio 120hz input ripple c out =25 ? f 60 72 db note 1: to avoid output oscillation, aluminum electrol ytic output capacitor is recommended and ceramic capacitor is not suggested. note 2: specifications are production tested at t a =25 ? c. specifications over the -40 ? c to 85 ? c operating temperature range are assured by design, characterization and correlation with statistical quality controls (sqc).
AIC1117A 5 ? typical performance characteristics load current fig. 1 load transient response time ( ? s) 0 40 80 120 160 200 0.1a 0.4a -0.1 -0.05 0 0.05 0.1 output voltage (v, ac) v in =5v c in =1 ? f c out =10 ? f (tantalum) v out =3.3v fig. 2 line transient response time ( ? s) output voltage (mv, ac) input voltage (v) 01 02 03 04 05 0 6.0 7.0 --100 --50 0 50 c out =10 ? f (tantalum) v out =3.3v 0 200 400 600 800 1000 1.16 1.18 1.20 1.22 1.24 1.26 fig. 3 dropout voltage (v out =3.3v) minimum differential voltage (v) output current (ma) fig. 4 minimum operating current differential voltage (v) minimum operating current (ma) 012345 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 t a =125? c fi g . 5 minimum load current ( ad j ustable version ) minimum load current ( ma ) input/output differential (v) t a = 25 ? c t a =0 ? c
AIC1117A 6 ? block diagram v in 55 ? a a dj v ref 1.25v - + gm + thermal limit current amp. v out gnd for fixed voltage device current limit ? pin descriptions adj pin - providing v ref =1.25v (typ.) for adjustable v out . v ref =v out -v adj and i adj =55 ? a (typ.) (gnd pin- power ground.) vout pin - adjustable output voltage. vin pin - power input.
AIC1117A 7 ? application information input-output capacitors linear regulators require input and output capacitors to maintain stability. input capacitor at 10? f with a 10 ? f aluminum electrolytic output capacitor is recommended. power dissipation the AIC1117A obtains thermal-limiting circuitry, which is designed to protect the device against overload condition. for continuous load condition, maximum rating of junction temperature must not be exceeded. it is important to pay more attention in thermal resistance. it includes junction to case, junction to ambient. the maximum power dissipation of AIC1117A depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. the rate of temperature rise is gr eatly affected by the mounting pad configuration on the pcb, the board material, and the ambient temperature. when the ic mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. the power dissipation across the device is p = i out (v in -v out ). the maximum power dissipation is: ja a max-j max r )t-(t p ? where t j-max is the maximum allowable junction temperature (125 ? c), and t a is the ambient temperature suitable in application. as a general rule, the lower temperature is, the better reliability of the device is. so the pcb mounting pad should provide maximum thermal conductivity to maintain low device temperature. ? application examples 125 r1 205 r2 + 10uf c2 + 10uf c1 mmbt2222a 1k r3 1k r4 vin vout a ic1117a 3 1 a dj 2 5v 3.3v ttl 125 r1 205 r2 + 100uf c2 + 10uf c1 vin vout a ic1117a 3 1 a dj 2 cad j 5v 3.3v * cad j can im p rove ri pp le re j ection fig. 6 v out =3.3v with shutdown fig. 7 improving ripple rejection 125 r1 + 10uf c2 + 10uf c1 vin vout a ic1117a 3 1 a dj 2 5v 1.25v + 100uf c2 + 10uf c1 vout a ic1117a-33 3 1 2 -3.3v d1 t1 vin floating input fig. 8 v out =1.25v application circuit fig. 9 low dropout negative supply
AIC1117A 8 ? physical dimensions (unit: mm) ? to-220 section a-a b a2 l l1 b2 e aa e p q d h1 a with plating base metal a1 c d1 e1 d2 thermal pad 2.54 5.85 1.15 3.54 12.70 2.04 0.51 2.54 bsc 6.86 14.23 0.35 0.38 h1 q p l1 l a2 d e a1 e1 c b2 b 6.85 3.42 6.35 4.08 14.73 2.92 1.77 1.39 8.90 16.51 0.61 1.01 3.56 min. s y m b o l a 4.82 max. to-220 millimeters d1 8.38 9.02 -- 9.66 e 10.66 d2 11.75 12.88 note: 1. refer to jedec to-220ab. 2. dimension "e" does not include mold flash, protrus ions or gate burrs. mold flash, protrusion or gate bur rs shall not exceed 6 mil per side . 3. dimension "d1" does not include inter-lead flash o r protrusions. 4. controlling dimensio n is millimeter, converted inc h dimensions are not necessarily exact.
AIC1117A 9 ? sot-223 3.30 0 1.55 0.90 6.70 6.30 0.23 2.90 0.66 0.02 e1 l e1 e b2 d e c b a2 a1 3.70 8 2.30 bsc 4.60 bsc 1.65 7.30 6.70 0.33 3.10 0.84 0.10 min. s y m b o l a 1.80 max. sot-223 millimeters note: 1. refer to jedec to-261aa. 2. dimension "d" does not include mold flash, protrus ions or gate burrs. mold flash, protrusion or gate bur rs shall not exceed 6 mil per side . 3. dimension "e1" does not include inter-lead flash o r protrusions. 4. controlling dimension is millimeter, converted inch dimensions are not necessarily exact. c b a a2 with plating view b 0.25 l seating plane gauge plane a1 base metal section a-a d e e1 e aa b2 e1 see view b
AIC1117A 10 ? to-263 e1 d1 section a-a b see view b c l2 e a a h d l1 a c2 b2 e l view b ? l3 gauge plane a1 seating plane with plating base metal thermal pad note: 1. refer to jedec to-263ab. 2. dimension "e" does not include mold flash, protrus ions or gate burrs. mold flash, protrusion or gate bur rs shall not exc eed 6 mil per side . 3. dim ension "d" does not include inter-lead flash or protrusions. 4. controlling dimensi on is millimeter, converted inc h dimensions are not necessarily exact. 0 0.51 -- 1.78 14.61 9.65 8.38 1.14 0.38 1.14 0.00 e l3 l2 l1 l h c d e c2 b2 b a1 2.54 bsc 8 1.68 1.78 2.79 15.88 0.25 bsc 0.99 10.67 9.65 1.65 0.74 1.78 0.25 4.06 min. s y m b o l a4 . 8 3 max. to-263-3l millimeters -- 6.86 d1 6.23 e1 -- --
AIC1117A 11 ? to-252 note: information provided by aic is believed to be accurate and reliable. however, we cannot assume responsibility for use of any ci rcuitry other than circuitry entirely embodied in an aic product; nor for any infringement of patents or other rights of third parties that may result from its use. we reserve the right to change t he circuitry and specifications without notice. life support policy: aic does not authorize any aic product for us e in life support devices and/or systems. life support device s or systems are devices or systems which, (i) are intended for surgic al implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeli ng, can be reasonably expected to result in a significant injury to the user. c2 see view b a h b3 a a e e d l3 l4 c base metal with plating seating plane b section a-a view b a1 l l1 gauge plane l2 ? thermal pad d1 e1 millimeters to-252-3l max. 2.38 a s y m b o l min. 2.19 0.13 5.46 0.61 0.89 6.22 6.73 0.89 2.67 ref 0.51 bsc 10.41 1.78 2.03 1.02 2.28 bsc a1 b b3 c2 e d c h l l1 l2 l4 l3 e 0.00 4.95 0.46 0.46 5.33 6.35 9.40 1.40 0.89 -- 0.64 0 8 ? 6.00 4.60 5.46 3.90 d1 e1 note: 1. refer to jedec to-252aa and ab. 2. dimension "e" does no t include mold flash, protrus ions or gate burrs. mold flash, protrus ion or gate bur rs shall not exceed 6 mil per side . 3. dimension " d" does not include inter-lead flash or protrusions. 4. contr olling dimension is mi llimeter, converted inc h dimensions are n ot necessarily exact.

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